• IC packages
  •        CDIP SB (Side-Braze Ceramic Dual In-Line Package)
           LCCC (Leadless Ceramic Chip Carrier)
           PGA (Pin Grid Array),LCPGA (Lead Ceramic PGA)
           BGA (Ball Grid Array)
           DIP (Dual-In-Line), PDIP (Plastic DIP)
           PLCC (Plastic Leaded Chip Carrier)
           PQF (Plastic Quad Flatpack)
           QFP (Quad Flat Package), SQFP (Shrink QFP), TQFP (Thin QFP)
           SOJ (Small Out-Line J-Lead)
           SOP (Small Out-Line Package), PSOP (Plastic SOP), SSOP (Shrink SOP)
           TSOP (Thin Small Out-Line Package)
           SIP (Single In-line Leaded Memory Package)
           SIMM (Single In-Line Leadless Memory Module)
  • Discrete packages
  •        Packages types
     
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